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Technische Details IPC0177 Chip Quik
Description: TSSOP-48 (LONG PINS) TO DIP-48 S, Packaging: Bulk, Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm), Material: FR4 Epoxy Glass, Number of Positions: 48, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP, Part Status: Active.
Weitere Produktangebote IPC0177 nach Preis ab 16.09 EUR bis 16.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
| IPC0177 | Chip Quik Inc. |
 Description: TSSOP-48 (LONG PINS) TO DIP-48 SPackaging: Bulk Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
| IPC0177 |
|
Hersteller: Chip Quik Inc.
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 (LONG PINS) TO DIP-48 S
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.09 EUR |