IPC0179 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-64 (LONG PINS) TO DIP-64 S
Packaging: Bulk
Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
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Technische Details IPC0179 Chip Quik Inc.
Description: TSSOP-64 (LONG PINS) TO DIP-64 S, Packaging: Bulk, Size / Dimension: 1.000" L x 3.200" W (25.40mm x 81.28mm), Material: FR4 Epoxy Glass, Number of Positions: 64, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: TSSOP.
Weitere Produktangebote IPC0179
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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IPC0179 | Hersteller : Chip Quik | Sockets & Adapters TSSOP-64 to DIP-64 SMT Adapter |
Produkt ist nicht verfügbar |