IPC0184 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Description: POWERPAD-24/POWERSOIC-24 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
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Technische Details IPC0184 Chip Quik Inc.
Description: POWERPAD-24/POWERSOIC-24 TO DIP-, Packaging: Bulk, Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm), Material: FR4 Epoxy Glass, Number of Positions: 24, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC.
Weitere Produktangebote IPC0184
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0184 | Hersteller : Chip Quik | Sockets & Adapters PowerPAD-24/Power SOIC-24 to DIP-28 |
Produkt ist nicht verfügbar |