IPC0185 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Description: POWERPAD-28/POWERSOIC-28 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
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Technische Details IPC0185 Chip Quik Inc.
Description: POWERPAD-28/POWERSOIC-28 TO DIP-, Packaging: Bulk, Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm), Material: FR4 Epoxy Glass, Number of Positions: 28, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC.
Weitere Produktangebote IPC0185
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0185 | Hersteller : Chip Quik | Sockets & Adapters PowerPAD-28/Power SOIC-28 to DIP-32 |
Produkt ist nicht verfügbar |