Technische Details IPC0266-S Chip Quik
Description: SOIC-8 (1.27 MM PITCH, 150/200 M, Packaging: Bulk, Material: FR4 Epoxy Glass, Number of Positions: 8, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: SOIC.
Weitere Produktangebote IPC0266-S nach Preis ab 23.3 EUR bis 26.85 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||
|---|---|---|---|---|---|---|---|---|---|
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IPC0266-S | Chip Quik Inc. |
 Description: SOIC-8 (1.27 MM PITCH, 150/200 MPackaging: Bulk Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0266-S |
|
Hersteller: Chip Quik Inc.
Description: SOIC-8 (1.27 MM PITCH, 150/200 M
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: SOIC-8 (1.27 MM PITCH, 150/200 M
Packaging: Bulk
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.85 EUR |
| 5+ | 23.3 EUR |