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IPL1-108-01-F-D-RA-K

IPL1-108-01-F-D-RA-K Samtec Inc.


tsw_th.pdf Hersteller: Samtec Inc.
Description: CONN HEADER R/A 16POS 2.54MM
Packaging: Tube
Connector Type: Header
Voltage Rating: 675VAC, 954VDC
Mounting Type: Through Hole, Right Angle
Number of Positions: 16
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.085" (2.16mm)
Insulation Height: 0.290" (7.37mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.215" (5.46mm)
auf Bestellung 53 Stücke:

Lieferzeit 21-28 Tag (e)
Anzahl Preis ohne MwSt
3+9.57 EUR
10+ 8.7 EUR
Mindestbestellmenge: 3
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Technische Details IPL1-108-01-F-D-RA-K Samtec Inc.

Description: CONN HEADER R/A 16POS 2.54MM, Packaging: Tube, Connector Type: Header, Voltage Rating: 675VAC, 954VDC, Mounting Type: Through Hole, Right Angle, Number of Positions: 16, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.085" (2.16mm), Insulation Height: 0.290" (7.37mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.215" (5.46mm).

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