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IT3D-200S-BGA(37) Hirose Connector


IT3_Series_Rev2017.pdf
Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 200P RECPT SMT DETACHABLE SIDE
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10+43.63 EUR
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48+40.38 EUR
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264+36.87 EUR
504+35.8 EUR
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Technische Details IT3D-200S-BGA(37) Hirose Connector

Description: CONN RCPT 200POS SMD GOLD, Features: Mating Side, Packaging: Box, Connector Type: Receptacle, Non-Gendered, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 200, Pitch: 0.069" (1.75mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 15mm ~ 40mm, Number of Rows: 40.

Weitere Produktangebote IT3D-200S-BGA(37)

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IT3D-200S-BGA(37) IT3D-200S-BGA(37) Hirose Electric Co Ltd IT3_Series_Rev2017.pdf Description: CONN RCPT 200POS SMD GOLD
Features: Mating Side
Packaging: Box
Connector Type: Receptacle, Non-Gendered
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 200
Pitch: 0.069" (1.75mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 15mm ~ 40mm
Number of Rows: 40
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IT3D-200S-BGA(37) IT3_Series_Rev2017.pdf
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 200POS SMD GOLD
Features: Mating Side
Packaging: Box
Connector Type: Receptacle, Non-Gendered
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 200
Pitch: 0.069" (1.75mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 15mm ~ 40mm
Number of Rows: 40
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH