IT5D-300S-BGA(39) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN INTERPOSER 300 POS
Mated Stacking Heights: 39mm
Contact Finish Thickness: 30.0µin (0.76µm)
Pitch: 0.059" (1.50mm)
Number of Positions: 300
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle
Features: Locking
Packaging: Tray
Produktrezensionen
Produktbewertung abgeben
Technische Details IT5D-300S-BGA(39) Hirose Electric Co Ltd
Description: CONN INTERPOSER 300 POS, Mated Stacking Heights: 39mm, Contact Finish Thickness: 30.0µin (0.76µm), Pitch: 0.059" (1.50mm), Number of Positions: 300, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Features: Locking, Packaging: Tray.
Weitere Produktangebote IT5D-300S-BGA(39)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
IT5D-300S-BGA(39) | Hersteller : Hirose Connector |
 Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |