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KMPC855TCZQ50D4

KMPC855TCZQ50D4 NXP USA Inc.


MPC860EC.pdf Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Box
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
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Technische Details KMPC855TCZQ50D4 NXP USA Inc.

Description: IC MPU MPC8XX 50MHZ 357BGA, Packaging: Box, Package / Case: 357-BBGA, Mounting Type: Surface Mount, Speed: 50MHz, Operating Temperature: -40°C ~ 95°C (TA), Core Processor: MPC8xx, Voltage - I/O: 3.3V, Supplier Device Package: 357-PBGA (25x25), Ethernet: 10Mbps (1), 10/100Mbps (1), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Communications; CPM, RAM Controllers: DRAM, Graphics Acceleration: No.