LPAF-20-03.0-S-08-2-K-TR Samtec Inc.
Hersteller: Samtec Inc.Description: .050" LP ARRAY HIGH-SPEED HIGH-
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Female Sockets
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 160
Pitch: 0.050" (1.27mm)
Height Above Board: 0.110" (2.79mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 4mm, 4.5mm
Part Status: Active
Number of Rows: 8
auf Bestellung 142 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 30.91 EUR |
| 10+ | 29.26 EUR |
| 25+ | 28.16 EUR |
| 50+ | 27.48 EUR |
| 100+ | 22.43 EUR |
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Technische Details LPAF-20-03.0-S-08-2-K-TR Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Female Sockets, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 160, Pitch: 0.050" (1.27mm), Height Above Board: 0.110" (2.79mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 4mm, 4.5mm, Part Status: Active, Number of Rows: 8.
Weitere Produktangebote LPAF-20-03.0-S-08-2-K-TR
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LPAF-20-03.0-S-08-2-K-TR | Hersteller : Samtec Inc. |
Description: .050" LP ARRAY HIGH-SPEED HIGH- Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 160 Pitch: 0.050" (1.27mm) Height Above Board: 0.110" (2.79mm) Contact Finish Thickness: 30.0µin (0.76µm) Mated Stacking Heights: 4mm, 4.5mm Part Status: Active Number of Rows: 8 |
Produkt ist nicht verfügbar |
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LPAF-20-03.0-S-08-2-K-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Socket |
Produkt ist nicht verfügbar |