
LPAF-30-03.5-L-06-2-K-TR Samtec

Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Socket
auf Bestellung 340 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 23.99 EUR |
10+ | 23.32 EUR |
25+ | 22.88 EUR |
50+ | 22.60 EUR |
100+ | 20.52 EUR |
250+ | 18.99 EUR |
500+ | 16.32 EUR |
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Technische Details LPAF-30-03.5-L-06-2-K-TR Samtec
Description: CONN ARRAY RCPT 180POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Board Guide, Pick and Place, Connector Type: Array, Female Sockets, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 180, Pitch: 0.050" (1.27mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 4.5mm, 5mm, Number of Rows: 6.
Weitere Produktangebote LPAF-30-03.5-L-06-2-K-TR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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LPAF-30-03.5-L-06-2-K-TR | Hersteller : Samtec |
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Produkt ist nicht verfügbar |
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LPAF-30-03.5-L-06-2-K-TR | Hersteller : Samtec Inc. |
![]() Packaging: Tape & Reel (TR) Features: Board Guide, Pick and Place Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
|
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LPAF-30-03.5-L-06-2-K-TR | Hersteller : Samtec Inc. |
![]() Packaging: Cut Tape (CT) Features: Board Guide, Pick and Place Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |