LPAF-30-03.5-L-06-2-K-TR Samtec
Hersteller: SamtecBoard to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
auf Bestellung 306 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 25.91 EUR |
| 10+ | 24.24 EUR |
| 25+ | 23.28 EUR |
| 50+ | 21.65 EUR |
| 100+ | 18.97 EUR |
| 250+ | 16.16 EUR |
| 500+ | 13.85 EUR |
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Technische Details LPAF-30-03.5-L-06-2-K-TR Samtec
Description: CONN ARRAY RCPT 180POS SMD GOLD, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Female Sockets, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 180, Pitch: 0.050" (1.27mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 4.5mm, 5mm, Number of Rows: 6.
Weitere Produktangebote LPAF-30-03.5-L-06-2-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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LPAF-30-03.5-L-06-2-K-TR | Hersteller : Samtec |
Conn Open Pin Field Array F 180 POS 1.27mm Solder ST Top Entry SMD LP Array™ T/R |
Produkt ist nicht verfügbar |
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LPAF-30-03.5-L-06-2-K-TR | Hersteller : Samtec Inc. |
Description: CONN ARRAY RCPT 180POS SMD GOLD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
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LPAF-30-03.5-L-06-2-K-TR | Hersteller : Samtec Inc. |
Description: CONN ARRAY RCPT 180POS SMD GOLD Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |