LPAF-30-03.5-L-06-2-K-TR Samtec
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.83 EUR |
| 10+ | 29.49 EUR |
| 25+ | 28.38 EUR |
| 50+ | 26.31 EUR |
| 100+ | 24.3 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details LPAF-30-03.5-L-06-2-K-TR Samtec
Description: CONN ARRAY RCPT 180POS SMD GOLD, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Female Sockets, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 180, Pitch: 0.050" (1.27mm), Height Above Board: 0.130" (3.30mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 4.5mm, 5mm, Number of Rows: 6.
Weitere Produktangebote LPAF-30-03.5-L-06-2-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
LPAF-30-03.5-L-06-2-K-TR | Samtec Inc. |
Description: CONN ARRAY RCPT 180POS SMD GOLD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
|
LPAF-30-03.5-L-06-2-K-TR | Samtec Inc. |
Description: CONN ARRAY RCPT 180POS SMD GOLD Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 180 Pitch: 0.050" (1.27mm) Height Above Board: 0.130" (3.30mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4.5mm, 5mm Number of Rows: 6 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| LPAF-30-03.5-L-06-2-K-TR |
|
Hersteller: Samtec Inc.
Description: CONN ARRAY RCPT 180POS SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Array, Female Sockets
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.050" (1.27mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4.5mm, 5mm
Number of Rows: 6
Description: CONN ARRAY RCPT 180POS SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Array, Female Sockets
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.050" (1.27mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4.5mm, 5mm
Number of Rows: 6
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPAF-30-03.5-L-06-2-K-TR |
|
Hersteller: Samtec Inc.
Description: CONN ARRAY RCPT 180POS SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Female Sockets
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.050" (1.27mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4.5mm, 5mm
Number of Rows: 6
Description: CONN ARRAY RCPT 180POS SMD GOLD
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Female Sockets
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 180
Pitch: 0.050" (1.27mm)
Height Above Board: 0.130" (3.30mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4.5mm, 5mm
Number of Rows: 6
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH