LPAF-30-03.5-L-06-2-K-TR Samtec
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
| Anzahl | Preis |
|---|---|
| 1+ | 25.91 EUR |
| 10+ | 24.78 EUR |
| 25+ | 23.85 EUR |
| 50+ | 22.11 EUR |
| 100+ | 20.42 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details LPAF-30-03.5-L-06-2-K-TR Samtec
Description: CONN ARRAY RCPT 180POS SMD GOLD, Number of Rows: 6, Mated Stacking Heights: 4.5mm, 5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.130" (3.30mm), Pitch: 0.050" (1.27mm), Number of Positions: 180, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Array, Female Sockets, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote LPAF-30-03.5-L-06-2-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
LPAF-30-03.5-L-06-2-K-TR | Samtec Inc. |
Description: CONN ARRAY RCPT 180POS SMD GOLD Number of Rows: 6 Mated Stacking Heights: 4.5mm, 5mm Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.130" (3.30mm) Pitch: 0.050" (1.27mm) Number of Positions: 180 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Array, Female Sockets Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH |
|
|
LPAF-30-03.5-L-06-2-K-TR | Samtec Inc. |
Description: CONN ARRAY RCPT 180POS SMD GOLD Pitch: 0.050" (1.27mm) Number of Positions: 180 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Array, Female Sockets Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Number of Rows: 6 Mated Stacking Heights: 4.5mm, 5mm Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.130" (3.30mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| LPAF-30-03.5-L-06-2-K-TR |
|
Hersteller: Samtec Inc.
Description: CONN ARRAY RCPT 180POS SMD GOLD
Number of Rows: 6
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Female Sockets
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Description: CONN ARRAY RCPT 180POS SMD GOLD
Number of Rows: 6
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.130" (3.30mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Female Sockets
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| LPAF-30-03.5-L-06-2-K-TR |
|
Hersteller: Samtec Inc.
Description: CONN ARRAY RCPT 180POS SMD GOLD
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Female Sockets
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Number of Rows: 6
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.130" (3.30mm)
Description: CONN ARRAY RCPT 180POS SMD GOLD
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Female Sockets
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Number of Rows: 6
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.130" (3.30mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH