LPAM-10-01.0-S-04-2-K-TR Samtec Inc.
Hersteller: Samtec Inc.Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 4
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Technische Details LPAM-10-01.0-S-04-2-K-TR Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Male Pins, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40, Pitch: 0.050" (1.27mm), Height Above Board: 0.145" (3.68mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 4mm, 4.5mm, Number of Rows: 4.
Weitere Produktangebote LPAM-10-01.0-S-04-2-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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LPAM-10-01.0-S-04-2-K-TR | Hersteller : Samtec |
Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal |
Produkt ist nicht verfügbar |