LPAM-10-01.0-S-06-2-K-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Number of Rows: 6
Mated Stacking Heights: 4mm, 4.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Height Above Board: 0.145" (3.68mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 60
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Male Pins
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
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Technische Details LPAM-10-01.0-S-06-2-K-TR Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D, Number of Rows: 6, Mated Stacking Heights: 4mm, 4.5mm, Contact Finish Thickness: 30.0µin (0.76µm), Height Above Board: 0.145" (3.68mm), Pitch: 0.050" (1.27mm), Number of Positions: 60, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Array, Male Pins, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote LPAM-10-01.0-S-06-2-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
LPAM-10-01.0-S-06-2-K-TR | Samtec |
Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 400 Stücke Im Einkaufswagen Stück im Wert von UAH |
| LPAM-10-01.0-S-06-2-K-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal
Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
Im Einkaufswagen
Stück im Wert von UAH