Technische Details LPAM-30-01.0-L-08-2-K-TR Samtec
Description: .050" LP ARRAY HIGH-SPEED HIGH-, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Male Pins, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 240, Pitch: 0.050" (1.27mm), Height Above Board: 0.145" (3.68mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 4mm, 4.5mm, Number of Rows: 8.
Weitere Produktangebote LPAM-30-01.0-L-08-2-K-TR nach Preis ab 26.87 EUR bis 41.61 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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LPAM-30-01.0-L-08-2-K-TR | Samtec |
 Conn Open Pin Field Array M 240 POS 1.27mm Solder ST Top Entry SMD T/R |
auf Bestellung 69 Stücke: Lieferzeit 14-21 Tag (e) |
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LPAM-30-01.0-L-08-2-K-TR | Samtec Inc. |
Description: .050" LP ARRAY HIGH-SPEED HIGH- Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Array, Male Pins Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 240 Pitch: 0.050" (1.27mm) Height Above Board: 0.145" (3.68mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4mm, 4.5mm Number of Rows: 8 |
auf Bestellung 233 Stücke: Lieferzeit 10-14 Tag (e) |
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LPAM-30-01.0-L-08-2-K-TR | Samtec |
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array |
auf Bestellung 325 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPAM-30-01.0-L-08-2-K-TR |
|
Hersteller: Samtec
Conn Open Pin Field Array M 240 POS 1.27mm Solder ST Top Entry SMD T/R
Conn Open Pin Field Array M 240 POS 1.27mm Solder ST Top Entry SMD T/R
auf Bestellung 69 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 40.01 EUR |
| LPAM-30-01.0-L-08-2-K-TR |
|
Hersteller: Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
Description: .050" LP ARRAY HIGH-SPEED HIGH-
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 240
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
auf Bestellung 233 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.47 EUR |
| 10+ | 35.25 EUR |
| 25+ | 33.03 EUR |
| 50+ | 31.51 EUR |
| LPAM-30-01.0-L-08-2-K-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
auf Bestellung 325 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 41.61 EUR |
| 10+ | 35.39 EUR |
| 25+ | 33.18 EUR |
| 50+ | 31.64 EUR |
| 325+ | 26.87 EUR |