LPAM-30-01.5-L-06-2-K-TR Samtec
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.4 EUR |
| 10+ | 31.96 EUR |
| 25+ | 30.75 EUR |
| 50+ | 28.5 EUR |
| 100+ | 26.32 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details LPAM-30-01.5-L-06-2-K-TR Samtec
Description: CONN ARRAY PLUG 180POS SMD GOLD, Number of Rows: 6, Part Status: Active, Mated Stacking Heights: 4.5mm, 5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.165" (4.20mm), Pitch: 0.050" (1.27mm), Number of Positions: 180, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Array, Male Pins, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote LPAM-30-01.5-L-06-2-K-TR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
LPAM-30-01.5-L-06-2-K-TR | Samtec Inc. |
Description: CONN ARRAY PLUG 180POS SMD GOLDPitch: 0.050" (1.27mm) Number of Positions: 180 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Array, Male Pins Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Number of Rows: 6 Part Status: Active Mated Stacking Heights: 4.5mm, 5mm Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.165" (4.20mm) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
|
LPAM-30-01.5-L-06-2-K-TR | Samtec Inc. |
Description: CONN ARRAY PLUG 180POS SMD GOLDNumber of Rows: 6 Part Status: Active Mated Stacking Heights: 4.5mm, 5mm Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.165" (4.20mm) Pitch: 0.050" (1.27mm) Number of Positions: 180 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Array, Male Pins Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH |
| LPAM-30-01.5-L-06-2-K-TR |
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Hersteller: Samtec Inc.
Description: CONN ARRAY PLUG 180POS SMD GOLD
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Male Pins
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Number of Rows: 6
Part Status: Active
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.165" (4.20mm)
Description: CONN ARRAY PLUG 180POS SMD GOLD
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Male Pins
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Number of Rows: 6
Part Status: Active
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.165" (4.20mm)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| LPAM-30-01.5-L-06-2-K-TR |
![]() |
Hersteller: Samtec Inc.
Description: CONN ARRAY PLUG 180POS SMD GOLD
Number of Rows: 6
Part Status: Active
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.165" (4.20mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Male Pins
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Description: CONN ARRAY PLUG 180POS SMD GOLD
Number of Rows: 6
Part Status: Active
Mated Stacking Heights: 4.5mm, 5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.165" (4.20mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 180
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Array, Male Pins
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH


