LPAM-50-01.0-L-08-2-K-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
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Technische Details LPAM-50-01.0-L-08-2-K-TR Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Array, Male Pins, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 400, Pitch: 0.050" (1.27mm), Height Above Board: 0.145" (3.68mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 4mm, 4.5mm, Number of Rows: 8.
Weitere Produktangebote LPAM-50-01.0-L-08-2-K-TR nach Preis ab 31.15 EUR bis 53.36 EUR
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LPAM-50-01.0-L-08-2-K-TR | Samtec Inc. |
Description: .050" LP ARRAY HIGH-SPEED HIGH-D Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Array, Male Pins Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 400 Pitch: 0.050" (1.27mm) Height Above Board: 0.145" (3.68mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 4mm, 4.5mm Number of Rows: 8 |
auf Bestellung 900 Stücke: Lieferzeit 10-14 Tag (e) |
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LPAM-50-01.0-L-08-2-K-TR | Samtec |
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array |
auf Bestellung 503 Stücke: Lieferzeit 10-14 Tag (e) |
|
| LPAM-50-01.0-L-08-2-K-TR |
|
Hersteller: Samtec Inc.
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
Description: .050" LP ARRAY HIGH-SPEED HIGH-D
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
Connector Type: Array, Male Pins
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 400
Pitch: 0.050" (1.27mm)
Height Above Board: 0.145" (3.68mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 4mm, 4.5mm
Number of Rows: 8
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 40.43 EUR |
| 10+ | 34.36 EUR |
| 25+ | 32.21 EUR |
| 50+ | 31.15 EUR |
| LPAM-50-01.0-L-08-2-K-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
auf Bestellung 503 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 53.36 EUR |
| 10+ | 51.02 EUR |
| 25+ | 49.12 EUR |
| 50+ | 45.51 EUR |
| 100+ | 39.09 EUR |
| 300+ | 33.26 EUR |
| 600+ | 32.42 EUR |