LPC1112FD20/102,52 NXP Semiconductors
Hersteller: NXP SemiconductorsDescription: LPC1112 - Scalable Entry Level 3
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 20-SO
Number of I/O: 16
auf Bestellung 190 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 190+ | 2.66 EUR |
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Technische Details LPC1112FD20/102,52 NXP Semiconductors
Description: LPC1112 - Scalable Entry Level 3, Packaging: Bulk, Package / Case: 20-SOIC (0.295", 7.50mm Width), Mounting Type: Surface Mount, Speed: 50MHz, Program Memory Size: 16KB (16K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M0, Data Converters: A/D 5x10b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I2C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, WDT, Supplier Device Package: 20-SO, Number of I/O: 16.
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LPC1112FD20/102,52 | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 4kBSRAM,16kBFLASH; SO20; 1.8÷3.6VDC Operating temperature: -40...85°C Number of inputs/outputs: 16 Peripherial: BoD; POR; watchdog Kind of architecture: Cortex M0 Family: LPC Memory: 4kB SRAM; 16kB FLASH Mounting: SMD Case: SO20 Supply voltage: 1.8...3.6V DC Type of integrated circuit: ARM microcontroller Interface: I2C; SPI; SSP; UART |
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