LPC1112FDH28/102:5 NXP Semiconductors
Hersteller: NXP SemiconductorsDescription: LPC1112 - Scalable 32-bit Microc
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 6x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
auf Bestellung 8647 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 201+ | 2.51 EUR |
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Technische Details LPC1112FDH28/102:5 NXP Semiconductors
Description: LPC1112 - Scalable 32-bit Microc, Packaging: Bulk, Package / Case: 28-TSSOP (0.173", 4.40mm Width), Mounting Type: Surface Mount, Speed: 50MHz, Program Memory Size: 16KB (16K x 8), RAM Size: 4K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M0, Data Converters: A/D 6x10b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: I2C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, POR, WDT, Supplier Device Package: 28-TSSOP, Number of I/O: 22.
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