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LPC1830FET256,551

LPC1830FET256,551 NXP Semiconductors


LPC1850_30_20_10-1893377.pdf Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 32BIT ARM CORTEX-M3 MCU 200KB SRAM
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Technische Details LPC1830FET256,551 NXP Semiconductors

Description: IC MCU 32BIT ROMLESS 256LBGA, Packaging: Tray, Package / Case: 256-LBGA, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 200K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 8x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Supplier Device Package: 256-LBGA (17x17), Number of I/O: 164, DigiKey Programmable: Not Verified.

Weitere Produktangebote LPC1830FET256,551

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LPC1830FET256,551 LPC1830FET256,551 Hersteller : NXP Semiconductors 419lpc1850_30_20_10.pdf MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 256-Pin LBGA Tray
Produkt ist nicht verfügbar
LPC1830FET256,551 Hersteller : NXP LPC1850_30_20_10.pdf Category: ARM NXP microcontrollers
Description: IC: ARM microcontroller; 32kBSRAM; LBGA256; 2.2÷3.6VDC
Case: LBGA256
Mounting: SMD
Operating temperature: -40...85°C
Supply voltage: 2.2...3.6V DC
Memory: 32kB SRAM
Type of integrated circuit: ARM microcontroller
Interface: CAN; EBI; EMI; Ethernet; I2C; I2S; IrDA; Microwire; QEI; SD; SPI; SSI; SSP; UART; USART; USB; USB OTG
Number of inputs/outputs: 164
Kind of architecture: Cortex M3
Anzahl je Verpackung: 90 Stücke
Produkt ist nicht verfügbar
LPC1830FET256,551 LPC1830FET256,551 Hersteller : NXP USA Inc. LPC1850_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 256LBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 256-LBGA (17x17)
Number of I/O: 164
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1830FET256,551 Hersteller : NXP LPC1850_30_20_10.pdf Category: ARM NXP microcontrollers
Description: IC: ARM microcontroller; 32kBSRAM; LBGA256; 2.2÷3.6VDC
Case: LBGA256
Mounting: SMD
Operating temperature: -40...85°C
Supply voltage: 2.2...3.6V DC
Memory: 32kB SRAM
Type of integrated circuit: ARM microcontroller
Interface: CAN; EBI; EMI; Ethernet; I2C; I2S; IrDA; Microwire; QEI; SD; SPI; SSI; SSP; UART; USART; USB; USB OTG
Number of inputs/outputs: 164
Kind of architecture: Cortex M3
Produkt ist nicht verfügbar