LPC1830FET256,551 NXP Semiconductors
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Technische Details LPC1830FET256,551 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 256LBGA, Packaging: Tray, Package / Case: 256-LBGA, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 200K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 8x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Supplier Device Package: 256-LBGA (17x17), Number of I/O: 164, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC1830FET256,551
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LPC1830FET256,551 | Hersteller : NXP Semiconductors |
 MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 256-Pin LBGA Tray |
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| LPC1830FET256,551 | Hersteller : NXP |
LPC1830FET256.551 ARM NXP microcontrollers |
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LPC1830FET256,551 | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 180MHz RAM Size: 200K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 8x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 256-LBGA (17x17) Number of I/O: 164 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |