Technische Details LPC1830FET256,551 NXP Semiconductors
Description: IC MCU 32BIT ROMLESS 256LBGA, DigiKey Programmable: Not Verified, Number of I/O: 164, Supplier Device Package: 256-LBGA (17x17), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Core Size: 32-Bit, Data Converters: A/D 8x10b; D/A 1x10b, Core Processor: ARM® Cortex®-M3, Program Memory Type: ROMless, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 200K x 8, Speed: 180MHz, Mounting Type: Surface Mount, Package / Case: 256-LBGA, Packaging: Tray.
Weitere Produktangebote LPC1830FET256,551
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LPC1830FET256,551 | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256LBGADigiKey Programmable: Not Verified Number of I/O: 164 Supplier Device Package: 256-LBGA (17x17) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10b; D/A 1x10b Core Processor: ARM® Cortex®-M3 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 200K x 8 Speed: 180MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray |
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