LPC2220FET144/G,55 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 16/32BIT ROMLESS 144TFBGA
Packaging: Bulk
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Speed: 75MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-TFBGA (12x12)
Part Status: Not For New Designs
Number of I/O: 76
DigiKey Programmable: Not Verified
auf Bestellung 1754 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 31+ | 15.73 EUR |
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Technische Details LPC2220FET144/G,55 NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144TFBGA, Packaging: Bulk, Package / Case: 144-TFBGA, Mounting Type: Surface Mount, Speed: 75MHz, RAM Size: 64K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 144-TFBGA (12x12), Part Status: Not For New Designs, Number of I/O: 76, DigiKey Programmable: Not Verified.
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LPC2220FET144/G,55 | Hersteller : NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 144TFBGA Packaging: Tray Package / Case: 144-TFBGA Mounting Type: Surface Mount Speed: 75MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-TFBGA (12x12) Part Status: Not For New Designs Number of I/O: 76 DigiKey Programmable: Not Verified |
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