LPC2290FBD144/01,5 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 16/32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 25.87 EUR |
| 10+ | 20.67 EUR |
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Technische Details LPC2290FBD144/01,5 NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 144LQFP, Packaging: Tray, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 60MHz, RAM Size: 64K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM7®, Data Converters: A/D 8x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Number of I/O: 76, DigiKey Programmable: Not Verified.
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