LPC2294HBD144/015 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Number of I/O: 112
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 8x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Produktrezensionen
Produktbewertung abgeben
Technische Details LPC2294HBD144/015 NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP, Number of I/O: 112, Part Status: Active, Supplier Device Package: 144-LQFP (20x20), Peripherals: POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V, Core Size: 16/32-Bit, Data Converters: A/D 8x10b, Core Processor: ARM7®, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 16K x 8, Program Memory Size: 256KB (256K x 8), Speed: 60MHz, Mounting Type: Surface Mount, Package / Case: 144-LQFP, Packaging: Bulk, DigiKey Programmable: Not Verified.