LPC2919FBD144/01551 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 144LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 80K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
Number of I/O: 108
Part Status: Active
Supplier Device Package: 144-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 16x10b
Core Processor: ARM9®
Program Memory Type: FLASH
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Technische Details LPC2919FBD144/01551 NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 144LQFP, Oscillator Type: Internal, Operating Temperature: -40°C ~ 85°C (TA), RAM Size: 80K x 8, Program Memory Size: 768KB (768K x 8), Speed: 80MHz, Mounting Type: Surface Mount, Package / Case: 144-LQFP, Packaging: Bulk, Number of I/O: 108, Part Status: Active, Supplier Device Package: 144-LQFP (20x20), Peripherals: POR, PWM, WDT, Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART, Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V, Core Size: 16/32-Bit, Data Converters: A/D 16x10b, Core Processor: ARM9®, Program Memory Type: FLASH.