LPC5506JBD64Y NXP Semiconductors
auf Bestellung 1500 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 133+ | 4.15 EUR |
| 500+ | 3.79 EUR |
| 1000+ | 3.44 EUR |
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Technische Details LPC5506JBD64Y NXP Semiconductors
Description: IC MCU 32BIT 256KB FLASH 64TQFP, Packaging: Tape & Reel (TR), Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 96MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 9x16b SAR, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Number of I/O: 45.
Weitere Produktangebote LPC5506JBD64Y nach Preis ab 5.31 EUR bis 7.32 EUR
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LPC5506JBD64Y | Hersteller : NXP USA Inc. |
 Description: IC MCU 32BIT 256KB FLASH 64TQFPPackaging: Cut Tape (CT) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 9x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 45 |
auf Bestellung 1390 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC5506JBD64Y | Hersteller : NXP Semiconductors |
32-bit ARM Cortex M33 RISC MCU |
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LPC5506JBD64Y | Hersteller : NXP Semiconductors |
MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 64-Pin HTQFP EP T/R |
Produkt ist nicht verfügbar |
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LPC5506JBD64Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 9x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 45 |
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LPC5506JBD64Y | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC5506JBD64 |
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| LPC5506JBD64Y | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 96kBSRAM,256kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 96kB SRAM; 256kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: CAN; GPIO; I2C; I2S; SPI; USART Number of inputs/outputs: 45 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Kind of core: 32-bit |
Produkt ist nicht verfügbar |