LPC5506JBD64Y NXP USA Inc.

Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 9x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 45
auf Bestellung 1390 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3+ | 7.32 EUR |
10+ | 6.50 EUR |
25+ | 6.20 EUR |
50+ | 5.98 EUR |
100+ | 5.77 EUR |
250+ | 5.50 EUR |
500+ | 5.31 EUR |
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Technische Details LPC5506JBD64Y NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP, Packaging: Tape & Reel (TR), Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 96MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 9x16b SAR, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Number of I/O: 45.
Weitere Produktangebote LPC5506JBD64Y
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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LPC5506JBD64Y | Hersteller : NXP Semiconductors |
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LPC5506JBD64Y | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 96kBSRAM,256kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 96kB SRAM; 256kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: CAN; GPIO; I2C; I2S; SPI; USART Number of inputs/outputs: 45 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Anzahl je Verpackung: 1500 Stücke |
Produkt ist nicht verfügbar |
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LPC5506JBD64Y | Hersteller : NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 256KB (256K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 9x16b SAR Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 45 |
Produkt ist nicht verfügbar |
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LPC5506JBD64Y | Hersteller : NXP |
![]() Description: IC: ARM microcontroller; 96kBSRAM,256kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 96kB SRAM; 256kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: CAN; GPIO; I2C; I2S; SPI; USART Number of inputs/outputs: 45 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog |
Produkt ist nicht verfügbar |