LPC55S14JBD64Y NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 855 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.15 EUR |
| 10+ | 7 EUR |
| 25+ | 6.46 EUR |
| 100+ | 5.87 EUR |
| 250+ | 5.59 EUR |
| 500+ | 5.42 EUR |
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Technische Details LPC55S14JBD64Y NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP, Packaging: Tape & Reel (TR), Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 128KB (128K x 8), RAM Size: 80K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Number of I/O: 36.
Weitere Produktangebote LPC55S14JBD64Y
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LPC55S14JBD64Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64HTQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 128KB (128K x 8) RAM Size: 80K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
Produkt ist nicht verfügbar |
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LPC55S14JBD64Y | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S14JBD64 |
Produkt ist nicht verfügbar |