LPC55S26JBD64Y NXP
Hersteller: NXP
Category: ARM NXP microcontrollers
Description: IC: ARM microcontroller; 128kBSRAM,256kBFLASH; HTQFP64
Type of integrated circuit: ARM microcontroller
Memory: 128kB SRAM; 256kB FLASH
Case: HTQFP64
Supply voltage: 1.8...3.6V DC
Mounting: SMD
Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB
Number of inputs/outputs: 36
Kind of architecture: Cortex M33
Operating temperature: -40...105°C
Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog
Anzahl je Verpackung: 1500 Stücke
Category: ARM NXP microcontrollers
Description: IC: ARM microcontroller; 128kBSRAM,256kBFLASH; HTQFP64
Type of integrated circuit: ARM microcontroller
Memory: 128kB SRAM; 256kB FLASH
Case: HTQFP64
Supply voltage: 1.8...3.6V DC
Mounting: SMD
Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB
Number of inputs/outputs: 36
Kind of architecture: Cortex M33
Operating temperature: -40...105°C
Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog
Anzahl je Verpackung: 1500 Stücke
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Technische Details LPC55S26JBD64Y NXP
Description: IC MCU 32BIT 256KB FLASH 64TQFP, Packaging: Tape & Reel (TR), Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 144K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: External, Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Number of I/O: 36.
Weitere Produktangebote LPC55S26JBD64Y
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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LPC55S26JBD64Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
Produkt ist nicht verfügbar |
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LPC55S26JBD64Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFP Packaging: Cut Tape (CT) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
Produkt ist nicht verfügbar |
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LPC55S26JBD64Y | Hersteller : NXP Semiconductors | ARM Microcontrollers - MCU LPC55S26JBD64 |
Produkt ist nicht verfügbar |
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LPC55S26JBD64Y | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 128kBSRAM,256kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 128kB SRAM; 256kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 36 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog |
Produkt ist nicht verfügbar |