LPC55S69JBD64E NXP USA Inc.

Description: IC MCU 32BIT 640KB FLASH 64HTQFP, Number of I/O: 36, Part Status: Active, Supplier Device Package: 64-HTQFP (10x10), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 10x16b SAR, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 320K x 8, Program Memory Size: 640KB (640K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Packaging: Tray.