LPC55S69JBD64E NXP Semiconductors
| Anzahl | Privatkunde |
|---|---|
| 16+ | 11.59 EUR |
| 17+ | 10.44 EUR |
| 50+ | 9.38 EUR |
| 100+ | 8.79 EUR |
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Technische Details LPC55S69JBD64E NXP Semiconductors
Description: IC MCU 32BIT 640KB FLASH 64HTQFP, Number of I/O: 36, Part Status: Active, Supplier Device Package: 64-HTQFP (10x10), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 10x16b SAR, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 320K x 8, Program Memory Size: 640KB (640K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Packaging: Tray.
Weitere Produktangebote LPC55S69JBD64E nach Preis ab 8.35 EUR bis 12.26 EUR
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LPC55S69JBD64E | NXP USA Inc. |
 Description: IC MCU 32BIT 640KB FLASH 64HTQFPNumber of I/O: 36 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tray |
auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC55S69JBD64E | NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S69JBD64 |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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| LPC55S69JBD64E |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.02 EUR |
| 10+ | 11.21 EUR |
| 25+ | 10.52 EUR |
| LPC55S69JBD64E |
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Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU LPC55S69JBD64
ARM Microcontrollers - MCU LPC55S69JBD64
auf Bestellung 58 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 12.26 EUR |
| 10+ | 11.41 EUR |
| 25+ | 10.72 EUR |
| 100+ | 9.17 EUR |
| 250+ | 8.68 EUR |
| 480+ | 8.44 EUR |
| 1120+ | 8.35 EUR |