LPC55S69JBD64E NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Number of I/O: 36
Part Status: Active
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 320K x 8
Program Memory Size: 640KB (640K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
| Anzahl | Preis |
|---|---|
| 2+ | 10.1 EUR |
| 10+ | 9.42 EUR |
| 25+ | 8.84 EUR |
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Technische Details LPC55S69JBD64E NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP, Number of I/O: 36, Part Status: Active, Supplier Device Package: 64-HTQFP (10x10), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 10x16b SAR, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 320K x 8, Program Memory Size: 640KB (640K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Packaging: Tray.
Weitere Produktangebote LPC55S69JBD64E nach Preis ab 7.02 EUR bis 10.3 EUR
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LPC55S69JBD64E | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S69JBD64 |
auf Bestellung 58 Stücke: Lieferzeit 10-14 Tag (e) |
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