LPC55S69JBD64Y NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
| Anzahl | Preis |
|---|---|
| 2+ | 13.97 EUR |
| 10+ | 10.83 EUR |
| 25+ | 10.05 EUR |
| 100+ | 9.19 EUR |
| 250+ | 8.78 EUR |
| 500+ | 8.53 EUR |
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Technische Details LPC55S69JBD64Y NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP, Number of I/O: 36, Part Status: Active, Supplier Device Package: 64-HTQFP (10x10), Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Core Size: 32-Bit Dual-Core, Data Converters: A/D 10x16b SAR, Core Processor: ARM® Cortex®-M33, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 320K x 8, Program Memory Size: 640KB (640K x 8), Speed: 150MHz, Mounting Type: Surface Mount, Package / Case: 64-TQFP Exposed Pad, Packaging: Tape & Reel (TR).
Weitere Produktangebote LPC55S69JBD64Y
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LPC55S69JBD64Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASH 64HTQFP Number of I/O: 36 Part Status: Active Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Dual-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 320K x 8 Program Memory Size: 640KB (640K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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LPC55S69JBD64Y | Hersteller : NXP Semiconductors |
ARM Microcontrollers - MCU LPC55S69JBD64 |
Produkt ist nicht verfügbar |