LPC55S69JBD64Y NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT 640KB FLASH 64HTQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
auf Bestellung 972 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 12.53 EUR |
| 10+ | 9.72 EUR |
| 25+ | 9.02 EUR |
| 100+ | 8.24 EUR |
| 250+ | 7.87 EUR |
| 500+ | 7.65 EUR |
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Technische Details LPC55S69JBD64Y NXP USA Inc.
Description: IC MCU 32BIT 640KB FLASH 64HTQFP, Packaging: Tape & Reel (TR), Package / Case: 64-TQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 150MHz, Program Memory Size: 640KB (640K x 8), RAM Size: 320K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M33, Data Converters: A/D 10x16b SAR, Core Size: 32-Bit Dual-Core, Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V, Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT, Supplier Device Package: 64-HTQFP (10x10), Part Status: Active, Number of I/O: 36.
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Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 320kBSRAM,640kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 320kB SRAM; 640kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 36 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog Anzahl je Verpackung: 1500 Stücke |
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LPC55S69JBD64Y | Hersteller : NXP USA Inc. |
Description: IC MCU 32BIT 640KB FLASH 64HTQFP Packaging: Tape & Reel (TR) Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 640KB (640K x 8) RAM Size: 320K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Part Status: Active Number of I/O: 36 |
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LPC55S69JBD64Y | Hersteller : NXP Semiconductors |
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| LPC55S69JBD64Y | Hersteller : NXP |
Category: ARM NXP microcontrollers Description: IC: ARM microcontroller; 320kBSRAM,640kBFLASH; HTQFP64 Type of integrated circuit: ARM microcontroller Memory: 320kB SRAM; 640kB FLASH Case: HTQFP64 Supply voltage: 1.8...3.6V DC Mounting: SMD Interface: GPIO; I2C; I2S; SDIO; SPI; USART; USB Number of inputs/outputs: 36 Kind of architecture: Cortex M33 Operating temperature: -40...105°C Integrated circuit features: Brown Out Reset (BOR); CRC; DMA; DSP; FPU; MPU; PoR; TRNG; watchdog |
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