LTN20069 Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: HEAT SINK BGA/PGA 16.5X16.5X8.9
Packaging: Bulk
Material: Aluminum
Length: 0.650" (16.51mm)
Shape: Square, Fins
Type: Board Level
Width: 0.653" (16.59mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM
Fin Height: 0.350" (8.89mm)
Material Finish: Black Anodized
Part Status: Active
| Anzahl | Preis |
|---|---|
| 8+ | 2.22 EUR |
| 10+ | 1.96 EUR |
| 25+ | 1.87 EUR |
| 50+ | 1.8 EUR |
| 100+ | 1.74 EUR |
| 250+ | 1.66 EUR |
| 500+ | 1.6 EUR |
| 3072+ | 1.52 EUR |
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Technische Details LTN20069 Wakefield Thermal Solutions
Description: HEAT SINK BGA/PGA 16.5X16.5X8.9, Packaging: Bulk, Material: Aluminum, Length: 0.650" (16.51mm), Shape: Square, Fins, Type: Board Level, Width: 0.653" (16.59mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 8.00°C/W @ 500 LFM, Fin Height: 0.350" (8.89mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote LTN20069 nach Preis ab 1.85 EUR bis 2.62 EUR
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LTN20069 | Hersteller : Wakefield-Vette |
Heat Sinks Penguin Coolers: Heat Sink for BGA, Super BGA, PBGA, and FPBGA, 16.5x16.5x8.9mm |
auf Bestellung 3016 Stücke: Lieferzeit 10-14 Tag (e) |
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LTN20069 | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 16.5mm; W: 16.5mm Material finishing: anodized Application: BGA Type of heatsink: extruded Heatsink shape: grilled Height: 8.9mm Width: 16.5mm Length: 16.5mm Material: aluminium Colour: black |
Produkt ist nicht verfügbar |