M2GL060T-FGG676I Microchip Technology
Hersteller: Microchip Technology
FPGA - Field Programmable Gate Array IGLOO2 Low Density FPGA, 56.5KLEs
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Technische Details M2GL060T-FGG676I Microchip Technology
Description: IC FPGA 387 I/O 676FBGA, DigiKey Programmable: Not Verified, Number of I/O: 387, Part Status: Active, Total RAM Bits: 1869824, Supplier Device Package: 676-FBGA (27x27), Number of Logic Elements/Cells: 56520, Voltage - Supply: 1.14V ~ 2.625V, Operating Temperature: -40°C ~ 100°C (TJ), Mounting Type: Surface Mount, Package / Case: 676-BGA, Packaging: Tray.
Weitere Produktangebote M2GL060T-FGG676I nach Preis ab 265.43 EUR bis 267.94 EUR
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M2GL060T-FGG676I | Microchip Technology |
Description: IC FPGA 387 I/O 676FBGA DigiKey Programmable: Not Verified Number of I/O: 387 Part Status: Active Total RAM Bits: 1869824 Supplier Device Package: 676-FBGA (27x27) Number of Logic Elements/Cells: 56520 Voltage - Supply: 1.14V ~ 2.625V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BGA Packaging: Tray |
auf Bestellung 160 Stücke: Lieferzeit 10-14 Tag (e) |
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| M2GL060T-FGG676I |
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Hersteller: Microchip Technology
Description: IC FPGA 387 I/O 676FBGA
DigiKey Programmable: Not Verified
Number of I/O: 387
Part Status: Active
Total RAM Bits: 1869824
Supplier Device Package: 676-FBGA (27x27)
Number of Logic Elements/Cells: 56520
Voltage - Supply: 1.14V ~ 2.625V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BGA
Packaging: Tray
Description: IC FPGA 387 I/O 676FBGA
DigiKey Programmable: Not Verified
Number of I/O: 387
Part Status: Active
Total RAM Bits: 1869824
Supplier Device Package: 676-FBGA (27x27)
Number of Logic Elements/Cells: 56520
Voltage - Supply: 1.14V ~ 2.625V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BGA
Packaging: Tray
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 267.94 EUR |
| 25+ | 265.43 EUR |