M55-7026842R Harwin Inc.
Hersteller: Harwin Inc.Description: CONN HEADER SMD 68POS 1.27MM
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Header
Current Rating (Amps): 1.2A
Mounting Type: Surface Mount
Number of Positions: 68
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Latch Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 1.00µin (0.025µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Rectangular
Insulation Height: 0.388" (9.86mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.157" (4.00mm)
auf Bestellung 1800 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 300+ | 3.34 EUR |
| 600+ | 3.25 EUR |
| 900+ | 2.96 EUR |
| 1500+ | 2.67 EUR |
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Technische Details M55-7026842R Harwin Inc.
Description: CONN HEADER SMD 68POS 1.27MM, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Current Rating (Amps): 1.2A, Mounting Type: Surface Mount, Number of Positions: 68, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Latch Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 1.00µin (0.025µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Rectangular, Insulation Height: 0.388" (9.86mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.157" (4.00mm).
Weitere Produktangebote M55-7026842R nach Preis ab 2.64 EUR bis 4.77 EUR
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M55-7026842R | Hersteller : Harwin |
Board to Board & Mezzanine Connectors 68P 1.27 SMC Male |
auf Bestellung 1969 Stücke: Lieferzeit 10-14 Tag (e) |
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M55-7026842R | Hersteller : Harwin Inc. |
Description: CONN HEADER SMD 68POS 1.27MM Features: Board Guide, Pick and Place, Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Current Rating (Amps): 1.2A Mounting Type: Surface Mount Number of Positions: 68 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Latch Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 1.00µin (0.025µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Rectangular Insulation Height: 0.388" (9.86mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.157" (4.00mm) |
auf Bestellung 2079 Stücke: Lieferzeit 10-14 Tag (e) |
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M55-7026842R | Hersteller : HARWIN |
Description: HARWIN - M55-7026842R - Stiftleiste, Board-to-Board, 1.27 mm, 2 Reihe(n), 68 Kontakt(e), Oberflächenmontage tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 68Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: Kontrol M55 Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 30 Stücke: Lieferzeit 14-21 Tag (e) |