MC32PF1550A1EPR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
auf Bestellung 4759 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 9.01 EUR |
100+ | 8.29 EUR |
250+ | 7.87 EUR |
500+ | 7.06 EUR |
1000+ | 5.95 EUR |
2500+ | 5.66 EUR |
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Technische Details MC32PF1550A1EPR2 NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 3.8V ~ 7V, Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices, Supplier Device Package: 40-HVQFN (5x5).
Weitere Produktangebote MC32PF1550A1EPR2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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MC32PF1550A1EPR2 | Hersteller : NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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MC32PF1550A1EPR2 | Hersteller : NXP Semiconductors | Power Management Specialised - PMIC Power Management IC 3 LDO Regs 40 QFN |
Produkt ist nicht verfügbar |