Technische Details MC32PF8121F1EP NXP Semiconductors
Description: IC POWER MANAGEMENT I.MX8M MINI, Packaging: Tray, Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: Industrial, IoT, Supplier Device Package: 56-HVQFN (8x8).
Weitere Produktangebote MC32PF8121F1EP
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
MC32PF8121F1EP | Hersteller : NXP USA Inc. |
 Description: IC POWER MANAGEMENT I.MX8M MINIPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: Industrial, IoT Supplier Device Package: 56-HVQFN (8x8) |
Produkt ist nicht verfügbar |
|
 |
MC32PF8121F1EP | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC Power Management IC, i.MX8, pre-prog, 7 buck, 4 LDO, Industrial, QFN 56 |
Produkt ist nicht verfügbar |