MC33909Q3ADR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 7mA
Supplier Device Package: 48-LQFP-EP (7x7)
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Technische Details MC33909Q3ADR2 NXP USA Inc.
Description: SBC 3V 1CAN 0LIN 6SG HLQFP48, Packaging: Tape & Reel (TR), Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 3.5V ~ 28V, Applications: System Basis Chip, Current - Supply: 7mA, Supplier Device Package: 48-LQFP-EP (7x7).