MC33FS5502Y3KSR2 NXP USA Inc.
Hersteller: NXP USA Inc.Description: HIGH VOLTAGE POWER MANAGEMENT IC
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: SMPS Start-Up
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MC33FS5502Y3KSR2 NXP USA Inc.
Description: HIGH VOLTAGE POWER MANAGEMENT IC, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 60V, Applications: SMPS Start-Up, Supplier Device Package: 56-HVQFN (8x8), Grade: Automotive, Qualification: AEC-Q100.