MC33FS6527LAER2 NXP USA Inc.
Hersteller: NXP USA Inc.Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MC33FS6527LAER2 NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO, Packaging: Tape & Reel (TR), Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 1V ~ 5V, Applications: System Basis Chip, Supplier Device Package: 48-HLQFP (7x7), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote MC33FS6527LAER2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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MC33FS6527LAER2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC System Basis Chip, DCDC 2.2A Vcore CAN LIN LDT, LQFP48EP |
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