MC33FS8510B6KSR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
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Technische Details MC33FS8510B6KSR2 NXP USA Inc.
Description: FS8500 C0, Packaging: Tape & Reel (TR), Qualification: AEC-Q100, Grade: Automotive, Supplier Device Package: 56-HVQFN (8x8), Current - Supply: 15mA, Applications: System Basis Chip, Voltage - Supply: 60V, Operating Temperature: -40°C ~ 125°C (TA), Mounting Type: Surface Mount, Wettable Flank, Package / Case: 56-VFQFN Exposed Pad.
Weitere Produktangebote MC33FS8510B6KSR2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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MC33FS8510B6KSR2 | Hersteller : NXP Semiconductors |
Power Management Specialised - PMIC FS8500 C0 |
Produkt ist nicht verfügbar |