MC33FS8510B6KSR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: FS8500 C0
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details MC33FS8510B6KSR2 NXP USA Inc.
Description: FS8500 C0, Packaging: Tape & Reel (TR), Package / Case: 56-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 60V, Applications: System Basis Chip, Current - Supply: 15mA, Supplier Device Package: 56-HVQFN (8x8), Grade: Automotive, Qualification: AEC-Q100.
Weitere Produktangebote MC33FS8510B6KSR2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
MC33FS8510B6KSR2 | Hersteller : NXP Semiconductors |
 Power Management Specialised - PMIC FS8500 C0 |
Produkt ist nicht verfügbar |