MCI0603TG22NHHBPDG INPAQ Technology Co., Ltd
Hersteller: INPAQ Technology Co., Ltd
Description: FIXED IND 22NH 150MA 1.2 OHM SMD
Packaging: Tape & Reel (TR)
Tolerance: ±3%
Package / Case: 0201 (0603 Metric)
Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Multilayer
Operating Temperature: -55°C ~ 125°C
DC Resistance (DCR): 1.2Ohm Max
Q @ Freq: 9 @ 500MHz
Frequency - Self Resonant: 2.5GHz
Material - Core: Ceramic
Inductance Frequency - Test: 500 MHz
Supplier Device Package: 0201
Height - Seated (Max): 0.013" (0.33mm)
Inductance: 22 nH
Current Rating (Amps): 150 mA
| Anzahl | Preis |
|---|---|
| 15000+ | 0.0044 EUR |
| 30000+ | 0.0042 EUR |
| 45000+ | 0.004 EUR |
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Technische Details MCI0603TG22NHHBPDG INPAQ Technology Co., Ltd
Description: FIXED IND 22NH 150MA 1.2 OHM SMD, Packaging: Tape & Reel (TR), Tolerance: ±3%, Package / Case: 0201 (0603 Metric), Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Multilayer, Operating Temperature: -55°C ~ 125°C, DC Resistance (DCR): 1.2Ohm Max, Q @ Freq: 9 @ 500MHz, Frequency - Self Resonant: 2.5GHz, Material - Core: Ceramic, Inductance Frequency - Test: 500 MHz, Supplier Device Package: 0201, Height - Seated (Max): 0.013" (0.33mm), Inductance: 22 nH, Current Rating (Amps): 150 mA.
Weitere Produktangebote MCI0603TG22NHHBPDG
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MCI0603TG22NHHBPDG | Hersteller : INPAQ Technology Co., Ltd |
Description: FIXED IND 22NH 150MA 1.2 OHM SMD Packaging: Cut Tape (CT) Tolerance: ±3% Package / Case: 0201 (0603 Metric) Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm) Mounting Type: Surface Mount Shielding: Unshielded Type: Multilayer Operating Temperature: -55°C ~ 125°C DC Resistance (DCR): 1.2Ohm Max Q @ Freq: 9 @ 500MHz Frequency - Self Resonant: 2.5GHz Material - Core: Ceramic Inductance Frequency - Test: 500 MHz Supplier Device Package: 0201 Height - Seated (Max): 0.013" (0.33mm) Inductance: 22 nH Current Rating (Amps): 150 mA |
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