MCIMX6Y2DVK09AB NXP Semiconductors
auf Bestellung 751 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 27.61 EUR |
| 10+ | 22.09 EUR |
| 100+ | 15.89 EUR |
| 260+ | 15.24 EUR |
| 5200+ | 15.22 EUR |
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Technische Details MCIMX6Y2DVK09AB NXP Semiconductors
Description: IC MPU I.MX6 900MHZ 272MAPBGA, Packaging: Tray, Package / Case: 272-LFBGA, Mounting Type: Surface Mount, Speed: 900MHz, Operating Temperature: 0°C ~ 95°C (TJ), Core Processor: ARM® Cortex®-A7, Voltage - I/O: 1.8V, 2.8V, 3.3V, Supplier Device Package: 272-MAPBGA (9x9), Ethernet: 10/100Mbps (2), USB: USB 2.0 OTG + PHY (2), Number of Cores/Bus Width: 1 Core, 32-Bit, Co-Processors/DSP: Multimedia; NEON™ MPE, RAM Controllers: LPDDR2, DDR3, DDR3L, Graphics Acceleration: No, Display & Interface Controllers: Electrophoretic, LCD, Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS, Part Status: Active, Additional Interfaces: CANbus, I2C, SPI, UART.
Weitere Produktangebote MCIMX6Y2DVK09AB
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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| MCIMX6Y2DVK09AB | Hersteller : NXP Semiconductors |
 SOC i.MX 6ULL ARM Cortex A7 40nm 272-Pin MAP-BGA Tray |
Produkt ist nicht verfügbar |
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MCIMX6Y2DVK09AB | Hersteller : NXP USA Inc. |
Description: IC MPU I.MX6 900MHZ 272MAPBGA Packaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.8V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Part Status: Active Additional Interfaces: CANbus, I2C, SPI, UART |
Produkt ist nicht verfügbar |