MCZ33903D3EKR2 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details MCZ33903D3EKR2 NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC, Packaging: Tape & Reel (TR), Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Mounting Type: Surface Mount, Interface: CAN, LIN, Voltage - Supply: 5.5V ~ 28V, Applications: System Basis Chip, Supplier Device Package: 32-SOIC-EP.
Weitere Produktangebote MCZ33903D3EKR2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
MCZ33903D3EKR2 | Hersteller : NXP Semiconductors | Power Management Specialised - PMIC System Basis Chip, 2x 3.3 V/400mA LDOs, 1 wakeup, SOIC 32 |
Produkt ist nicht verfügbar |