MCZ33905BS5EKR2 Freescale Semiconductor
Hersteller: Freescale Semiconductor
Description: SYSTEM BASIS CHIP, POWER MANAGEM
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
Description: SYSTEM BASIS CHIP, POWER MANAGEM
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
83+ | 5.82 EUR |
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Technische Details MCZ33905BS5EKR2 Freescale Semiconductor
Description: SYSTEM BASIS CHIP, POWER MANAGEM, Packaging: Bulk, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 5.5V ~ 28V, Applications: System Basis Chip, Current - Supply: 2.8mA, Supplier Device Package: 32-HSOP, Grade: Automotive.
Weitere Produktangebote MCZ33905BS5EKR2
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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MCZ33905BS5EKR2 | Hersteller : NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 5.5V ~ 28V Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
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