
MCZ33905DS3EKR2,518 NXP USA Inc.

Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Packaging: Bulk
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 2.8mA
Supplier Device Package: 32-HSOP
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 949 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
56+ | 8.68 EUR |
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Technische Details MCZ33905DS3EKR2,518 NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V, Packaging: Bulk, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 5.5V ~ 28V, Applications: System Basis Chip, Current - Supply: 2.8mA, Supplier Device Package: 32-HSOP, Grade: Automotive, Qualification: AEC-Q101.
Weitere Produktangebote MCZ33905DS3EKR2,518
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
MCZ33905DS3EKR2,518 | Hersteller : NXP |
![]() tariffCode: 85423990 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 SVHC: No SVHC (14-Jun-2023) |
auf Bestellung 949 Stücke: Lieferzeit 14-21 Tag (e) |