MCZ33905DS3EKR2,518 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: 32-HSOP
Current - Supply: 2.8mA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 28V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Bulk
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Technische Details MCZ33905DS3EKR2,518 NXP USA Inc.
Description: SYSTEM BASIS CHIP, LIN, 2X 3.3V, Qualification: AEC-Q101, Grade: Automotive, Supplier Device Package: 32-HSOP, Current - Supply: 2.8mA, Applications: System Basis Chip, Voltage - Supply: 5.5V ~ 28V, Operating Temperature: -40°C ~ 125°C (TA), Mounting Type: Surface Mount, Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad, Packaging: Bulk.

