MFS2613AMDH3AD NXP Semiconductors
Hersteller: NXP Semiconductors
Power Management Specialised - PMIC Safety System Basis Chip with Low Power for ASIL D, LQFP-48 tray
| Anzahl | Privatkunde |
|---|---|
| 1+ | 15.16 EUR |
| 10+ | 11.98 EUR |
| 25+ | 11.19 EUR |
| 100+ | 10.39 EUR |
| 250+ | 10.16 EUR |
| 500+ | 9.72 EUR |
| 1000+ | 9.64 EUR |
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Technische Details MFS2613AMDH3AD NXP Semiconductors
Description: MFS2613AMDH3AD, Packaging: Tray, Package / Case: 48-LQFP Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 3.2V ~ 36V, Applications: System Basis Chip, Supplier Device Package: 48-LQFP-EP (7x7).
Weitere Produktangebote MFS2613AMDH3AD nach Preis ab 10.42 EUR bis 15.57 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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MFS2613AMDH3AD | NXP USA Inc. |
Description: MFS2613AMDH3AD Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) |
auf Bestellung 487 Stücke: Lieferzeit 10-14 Tag (e) |
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| MFS2613AMDH3AD |
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Hersteller: NXP USA Inc.
Description: MFS2613AMDH3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Description: MFS2613AMDH3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
auf Bestellung 487 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.57 EUR |
| 10+ | 12.08 EUR |
| 25+ | 11.21 EUR |
| 100+ | 10.42 EUR |