MIMX8US3DVP08SC NXP USA Inc.
Hersteller: NXP USA Inc.Description: I.MX8ULP,DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A35
Supplier Device Package: 485-LFBGA (15x15)
Ethernet: 10/100Mbps
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M33
RAM Controllers: LPDDR3, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 25.41 EUR |
| 10+ | 20.26 EUR |
| 25+ | 18.97 EUR |
| 100+ | 18.70 EUR |
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Technische Details MIMX8US3DVP08SC NXP USA Inc.
Description: I.MX8ULP,DUAL 800MHZ, Packaging: Tray, Package / Case: 485-LFBGA, Mounting Type: Surface Mount, Speed: 800MHz, Operating Temperature: 0°C ~ 95°C (TJ), Core Processor: ARM® Cortex®-A35, Supplier Device Package: 485-LFBGA (15x15), Ethernet: 10/100Mbps, USB: USB 2.0 (2), Number of Cores/Bus Width: 1 Core, 64-Bit, Co-Processors/DSP: ARM® Cortex®-M33, RAM Controllers: LPDDR3, LPDDR4, Graphics Acceleration: No, Display & Interface Controllers: MIPI-CSI, MIPI-DSI, Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB.
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MIMX8US3DVP08SC | Hersteller : NXP Semiconductors |
RF System on a Chip - SoC i.MX 8ULP: Arm Cortex-A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications |
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