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Technische Details MMS-108-02-L-DH Samtec
Description: CONN RCPT 16P 0.079 GOLD SMD R/A, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 16, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.9A per Contact, Connector Type: Receptacle, Packaging: Tube, Number of Rows: 2, Row Spacing - Mating: 0.079" (2.00mm), Insulation Height: 0.157" (4.00mm).
Weitere Produktangebote MMS-108-02-L-DH
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| MMS-108-02-L-DH |
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auf Bestellung 334 Stücke: Lieferzeit 21-28 Tag (e) |
