Technische Details MMS-130-02-L-SH Samtec
Description: CONN RCPT 30P 0.079 GOLD SMD R/A, Number of Rows: 1, Insulation Height: 0.085" (2.15mm), Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Female Socket, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Positions: 30, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.9A per Contact, Connector Type: Receptacle, Packaging: Tube.
Weitere Produktangebote MMS-130-02-L-SH
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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MMS-130-02-L-SH | Hersteller : Samtec Inc. |
Description: CONN RCPT 30P 0.079 GOLD SMD R/ANumber of Rows: 1 Insulation Height: 0.085" (2.15mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board or Cable Number of Positions: 30 Mounting Type: Surface Mount, Right Angle Current Rating (Amps): 3.9A per Contact Connector Type: Receptacle Packaging: Tube |
auf Bestellung 141 Stücke: Lieferzeit 10-14 Tag (e) |

