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MPF5023CMBA0ESR2 NXP USA Inc.


Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MPF5023CMBA0ESR2 NXP USA Inc.

Description: POWER MANAGEMENT IC, PRE-PROG, 3, Packaging: Tape & Reel (TR), Package / Case: 40-VFQFN Exposed Pad, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 2.5V ~ 5.5V, Applications: High Performance i.MX 8, S32x Processor Based, Current - Supply: 200µA, Supplier Device Package: 40-HVQFN (6x6), Grade: Automotive, Qualification: AEC-Q100.

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MPF5023CMBA0ESR2 Hersteller : NXP Semiconductors PF5023-1840300.pdf Power Management Specialised - PMIC Power Management IC, pre-prog, 3 step-down DC/DC, ASIL-B Safety Level
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