
MPF5032BMBA0ES NXP USA Inc.
Hersteller: NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC 2 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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Technische Details MPF5032BMBA0ES NXP USA Inc.
Description: PMIC 2 BUCKS 2 LDO A1 DIE, Packaging: Tray, Package / Case: 40-PowerVFQFN, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 3.3V ~ 5.25V, Applications: System Basis Chip, Supplier Device Package: 40-HVQFN (6x6), Grade: Automotive, Qualification: AEC-Q100.
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MPF5032BMBA0ES | Hersteller : NXP Semiconductors |
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