Produkte > NXP USA INC. > MPF5123AMMA0ESR2

MPF5123AMMA0ESR2 NXP USA Inc.


PF0300.pdf
Hersteller: NXP USA Inc.
Description: SUPERSET COVERING PF5123 QM DEVI
Packaging: Tray
Package / Case: 28-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.95V ~ 5.5V
Applications: Processor
Current - Supply: 1.5µA
Supplier Device Package: 28-HWQFN (4.5x4.5)
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Technische Details MPF5123AMMA0ESR2 NXP USA Inc.

Description: SUPERSET COVERING PF5123 QM DEVI, Packaging: Tray, Package / Case: 28-PowerWFQFN, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 2.95V ~ 5.5V, Applications: Processor, Current - Supply: 1.5µA, Supplier Device Package: 28-HWQFN (4.5x4.5).