MPF5200AMBA1ES NXP USA Inc.
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 32-PowerWFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 40µA
Supplier Device Package: 32-HWQFN (5x5)
Grade: Automotive
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Technische Details MPF5200AMBA1ES NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3, Packaging: Tray, Package / Case: 32-PowerWFQFN, Mounting Type: Surface Mount, Wettable Flank, Operating Temperature: -40°C ~ 125°C, Voltage - Supply: 2.7V ~ 5.5V, Current - Supply: 40µA, Supplier Device Package: 32-HWQFN (5x5), Grade: Automotive.